CPO Integration Engineer - LPU Packaging at NVIDIA

You are an experienced packaging engineer with at least eight years in semiconductor development and a Master’s degree in a technical field like Materials Science or Mechanical Engineering. You have deep knowledge of photonic integration and heterogeneous assembly processes. **What makes it worth a look...** NVIDIA is hiring for this role in Santa Clara, California, offering a base salary range between $152,000 and $287,500 depending on your level. You will also receive equity and a comprehensive benefits package while working at the center of the artificial intelligence revolution. **You might be a good fit if you...** * Possess hands-on experience with optical module integration, photonic alignment, and coupling techniques. * Understand reliability standards and qualification methodologies for optical modules. * Have worked on 2.5D or 3D heterogeneous integration using technologies like TSV or hybrid bonding. * Are proficient with thermal and mechanical modeling or optical simulation tools like Lumerical and COMSOL.