IC Packaging Engineer at NVIDIA

You're a mid-level engineer with at least two years of experience in semiconductor packaging and development. A Bachelor's degree in Mechanical or Material Engi

Work type: onsite

Location: Israel, Yokneam

Type: Full-time

You're a mid-level engineer with at least two years of experience in semiconductor packaging and development. A Bachelor's degree in Mechanical or Material Engineering, or equivalent experience, is required. **What makes it worth a look...** NVIDIA is seeking a Package Engineer for an on-site, full-time role in Yokneam, Israel. While specific compensation isn't listed, the company mentions highly competitive salaries and a comprehensive benefits package. **You might be a good fit if you...** * Have experience with 2D ArtiosCAD and 3D NX/SolidWorks/Creo applications. * Understand DFM, tooling design, manufacturing processes, material properties, and metrology tools. * Possess leadership skills for cross-company projects and experience in a manufacturing environment.

View this job on nocollar jobs