IC Packaging Engineer at NVIDIA
You're a mid-level engineer with at least two years of experience in semiconductor packaging and development. A Bachelor's degree in Mechanical or Material Engi
Work type: onsite
Location: Israel, Yokneam
Type: Full-time
You're a mid-level engineer with at least two years of experience in semiconductor packaging and development. A Bachelor's degree in Mechanical or Material Engineering, or equivalent experience, is required.
**What makes it worth a look...**
NVIDIA is seeking a Package Engineer for an on-site, full-time role in Yokneam, Israel. While specific compensation isn't listed, the company mentions highly competitive salaries and a comprehensive benefits package.
**You might be a good fit if you...**
* Have experience with 2D ArtiosCAD and 3D NX/SolidWorks/Creo applications.
* Understand DFM, tooling design, manufacturing processes, material properties, and metrology tools.
* Possess leadership skills for cross-company projects and experience in a manufacturing environment.
View this job on nocollar jobs